BGA bump 3D inspection
X02WT Series
- Inline types
Product Introduction
- Acquires low-noise 3D images for stable inspection
- Measures volume to detect excess or shortage
- Establish traceability of inspection results by introducing the CatchSystem (optional)
Inspection Examples
Here is an example of what can be inspected with this device. We also accept requests for verification using sample boards.
bridge
foreign body
Different bump sizes
Bump height difference
No bump installed
Features
Features 01
By measuring the height of the bump, it is possible to detect missing parts, incorrect heights, and incorrect sizes.
Acquires low-noise 3D images and detects height and size differences that are easily overlooked by the naked eye
Features 02
Easy teaching
Detects bridges and foreign objects by measuring the height around the bump
Features 03
Establish traceability of inspection results with CatchSystem (optional)
Images taken during the inspection can be automatically saved.
In addition to determining whether an item is good or bad, 3D images can also be saved, allowing you to check the inspection results later.
OPTION
We offer options to help you get the most out of your inspection operations.
Please use this to reduce man-hours and improve quality.
CatchSystem
The results obtained from the inspection are saved in a database and can be checked using images. By aggregating and analyzing the accumulated data, it is possible to understand the operating status of each device, reduce defects, and improve production quality.
The Catch System collects all information from inspection equipment and establishes traceability in production management.
* Separate Windows PC required
Offline Teaching
Inspection data can be created without stopping the inspection equipment. Inspection data can be created offline on the same screen as the inspection equipment.
Immediately after inspection, defective images are automatically saved, allowing debugging work to be performed on the OLT (not applicable to the X02W).
It can also be used for in-house training purposes.
*A separate PC equivalent to the inspection machine is required.
Operational image
Contributing to systemization
It can be installed in any process, such as bottom-side inspection after flow soldering, double-sided inspection of the component side and solder side, etc. It can also be used for custom-made unitized lines.
Specification.
X02WT-350L
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External dimensions | W980 x D1000 x H1650 (mm) |
Body weight | 500kg |
Power | Single phase AC200V - 240V |
Applicable board size | Mini:X50 Y50mm Max:X350 Y350mm |
Board Weight | Max: 2.0kg |
Implementation Limitations | Top surface 50mm, bottom surface 40mm |
Camera | 9 Mega pixel top camera |
lens | Telecentric lens |
Lens resolution | 8μ |
Field of view | 24 × 24mm |
Light | White lighting (dedicated 3D lighting) |
Height measurement | ±3mm from the reference plane (maximum 6mm on the board) / Measurement accuracy ±20μm |
Power | 1000W (including PC) |
Conveyor Speed | 10-500mm / sec |
Inspection time | 1.2 sec/screen (□24mmFOV) |
Board fixing method | Mini:X50 Y50mm Max:X350 Y350mm |
Inspection target board thickness | 0.6 ~ 2.0mm |
