Bottom full 3D
X02W Series
- Autonomous offline
- Inline types
Product Introduction
- Acquires low-noise 3D images for stable inspection
- Measures fillet volume to detect excess or insufficient solder
- PIN height defects (horns and part lift) can be detected by PIN length measurement
- Height measurement for part presence and foreign object inspection
- Establish traceability of inspection results by introducing the CatchSystem (optional)
Inspection Examples
Here is an example of what can be inspected with this device. We also accept requests for verification using sample boards.
Excessive solder
Insufficient solder
bridge
PIN height abnormality
Out of stock
foreign body
Autonomous offline
As it is a stand-alone type, there is no need to set up a table, and all PC equipment is built into the device.
An area sensor (optional automatic door) is installed at the board set entrance to ensure safety during inspection.
- With a top clearance of 150 mm (when using an area sensor), it is not affected by the height of the inserted components.
- Inspection after board separation is also possible
- The dedicated rail jig for PCBs allows flexible PCB setting.
- M-size board compatible, inspection range 350 x 250 mm
X02WB-350Inline types
By incorporating it into the DIP line and automating it, labor savings are realized.
After in-line selective soldering, inspection is possible without the need for a reversing machine.
- Inline operation possible while maintaining offline inspection performance
- L-size board compatible, inspection range 550 x 550 mm
X02WB-550LFeatures
Features 01
Low-noise 3D images
It faithfully reproduces the actual solder fillet, reduces lighting reflections, and improves the visibility of DIP solder.
Features 02
Easy teaching
By quantifying the fillet volume, anyone can easily set up an inspection program.
It can accurately detect fillets and bridges that are difficult to detect with 2D inspection, such as subtle excess or deficiency of solder.
Features 03
Traceability
Like conventional inspection machines, it can be connected to the optional "CatchSystem" to ensure traceability of inspection results.
3D images taken during the examination can also be checked later.
OPTION
We offer options to help you get the most out of your inspection operations.
Please use this to reduce man-hours and improve quality.
CatchSystem
The results obtained from the inspection are saved in a database and can be checked using images. By aggregating and analyzing the accumulated data, it is possible to understand the operating status of each device, reduce defects, and improve production quality.
The Catch System collects all information from inspection equipment and establishes traceability in production management.
* Separate Windows PC required
Offline Teaching
Inspection data can be created without stopping the inspection equipment. Inspection data can be created offline on the same screen as the inspection equipment.
Immediately after inspection, defective images are automatically saved, allowing debugging work to be performed on the OLT (not applicable to the X02W).
It can also be used for in-house training purposes.
*A separate PC equivalent to the inspection machine is required.
Operational image
High-precision automatic inspection ensures stable quality
It is possible to inspect the board downstream of the DIP soldering machine without having to turn it over.
By combining it with Marantz Electronics loaders and unloaders, automatic width adjustment is possible when changing models, which contributes to reducing the man-hours required for changeovers.
Specification.
|
X02WB-350
|
X02WB-550L
|
|
External dimensions | W980 x D998 x H1210mm | W1200 x D1220 x H1750 (mm) |
Body weight | 210 kg | 500kg |
Power | AC100V - 240V | AC100V - 240V |
Applicable board size | Mini: 50 x 50 mm Max: 350 x 250 mm | Mini:X50 Y50mm Max:X550 Y550mm |
Board Weight | 1.5 kg | 2.0kg |
Implementation Limitations | Top: 150 mm, bottom: 150 mm (area sensor)
Top surface: 100 mm, bottom surface: 150 mm (automatic opening/closing door) | Top surface: 50mm, bottom surface: 40mm |
Camera | 9 Mega pixel top camera | 9 Mega pixel top camera |
lens | Telecentric lens | Telecentric lens |
Lens resolution | 19 μm | 19μ |
Field of view | 60 x 60 mm | 60 × 60 mm |
Light | White lighting (dedicated 3D lighting) | White lighting (dedicated 3D lighting) |
Height measurement | ±6 mm from the reference plane (maximum 12 mm above the board) Measurement accuracy ±20 µm | ±6mm from the reference plane (maximum 12mm on the board) Measurement accuracy: ±20µm |
