In-line underside inspection device
B series
- Inline types
Unlike conventional board appearance inspections, this "inspection from below" allows for automated inspection and data management of DIP solder, which is primarily done visually.
Product Introduction
- After the DIP soldering process, DIP solder inspection is possible from the bottom of the board without the need for a turnover machine.
- Available in two sizes: M size (350 x 250 mm) and L size (550 x 550 mm)
- Establish traceability of inspection results by introducing the CatchSystem (optional)
Inspection Examples
Here is an example of what can be inspected with this device. We also accept requests for verification using sample boards.
Part presence/misalignment
Polarity Inspection
Character inspection
Foreign body inspection
SMT solder inspection
IC Bridge
Solder ball
Barcode scan
DIP solder inspection
DIP Bridge
Presence of PIN
Solderless
Features
Features 01
Automated inspection and data management for DIP solder, which is currently mainly performed by visual inspection
Automated inspections unify inspection standards and compile inspection results, enabling analysis of defect causes and establishing traceability.
By installing an eight-direction angle camera (optional), it is possible to check the DIP fillet using actual images from multiple directions.
Features 02
Reduces board stress and improves productivity by eliminating processes
It avoids the human and mechanical stress caused by flipping the board, contributing to stable quality.
Eliminating the need for a turnover machine simplifies production equipment, saves space, and also saves energy (reduced electricity and air consumption).
OPTION
We offer options to help you get the most out of your inspection operations.
Please use this to reduce man-hours and improve quality.
CatchSystem
The results obtained from the inspection are saved in a database and can be checked using images. By aggregating and analyzing the accumulated data, it is possible to understand the operating status of each device, reduce defects, and improve production quality.
The Catch System collects all information from inspection equipment and establishes traceability in production management.
* Separate Windows PC required
Offline Teaching
Inspection data can be created without stopping the inspection equipment. Inspection data can be created offline on the same screen as the inspection equipment.
Immediately after inspection, defective images are automatically saved, allowing debugging work to be performed on the OLT (not applicable to the X02W).
It can also be used for in-house training purposes.
*A separate PC equivalent to the inspection machine is required.
Operational image
Ideal for after soldering equipment
By installing it after the flow layer or point DIP soldering equipment, inspection can be performed directly without the need for a turnover machine. Early detection and correction of mounting defects contributes to quality improvement.
By connecting with Marantz Electronics conveyors, it is possible to automatically link rail width and length and automatically change models linked to barcodes.
Specification.
U22XB-350L
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U22XB-550L
|
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External dimensions | W878 x D916 x H1313mm | W1078 x D1217 x H1331mm |
Body weight | 210 kg | 330 kg |
Power | AC 100V - 240V | AC 100V - 240V |
Implementation Limitations | Top 60mm Bottom 20mm | Top 60mm Bottom 20mm |
Camera | 5M | 5M |
lens | Telecentric lens | Telecentric lens |
Field of view | 36 x 30 mm (15 μm) | 36 x 30 mm (15 μm) |
Light | DL lighting or ML lighting | DL lighting or ML lighting |
Inspection range | 350 x 250 mm | 550 x 550 mm |
Angle Camera | OPTION | OPTION |
Z-axis stroke | 30 mm | 30 mm |
Laser height measurement | ー | ー |
Power | 350 W | 350 W |
Conveyor Speed | 10-500 mm/sec | 10-500 mm/sec |
Inspection time | 0.3 sec/screen | 0.3 sec/screen |
