EMS Board mounting

The company specializes in the extremely small chip mounting and high-density mounting of circuit boards that are now essential for the manufacture of machinery and electrical appliances, and also handles fine processing according to customer requests.
In recent years, we have been focusing on mounting electronic components on high-precision, high-density boards using our unique technology.
We have achieved the implementation of extremely small chip sizes such as 0402 chips (0.4mm x 0.2mm).
Even the slightest misalignment during chip mounting can easily cause interference with other chips. For such difficult-to-process products, the company's technical capabilities and flexible response capabilities will help.

[Large board dimensions]
Board dimensions up to 250mm x 330mm are called M size, and up to 510mm x 460mm are called L size.
We are able to implement even larger sizes up to LL size, up to 660mm x 610mm.

[Electronic components mounted on large circuit boards]
Large boards are mounted with a mixture of components of various sizes, with some boards mounting chip components as small as 0.4mm x 0.2mm and as large as 74mm components.
Special components include large surface mount components such as BGA (Ball Grid Array) and LGA (Land Grid Array), as well as insertion components such as multi-pin press-fit connectors and ultra-multi-pole array type connectors.

[Large substrate applications]
Large substrates are used in large multi-layer boards (multi-layer printed wiring boards) for semiconductor inspection equipment, communication infrastructure equipment, aerospace and electrical equipment, semiconductor test equipment, etc., and require high quality and reliability.
There are not many factories that have mounting lines that can handle LL size up to 660mm x 610mm.

While electronic devices are increasingly being manufactured using SMT, axial and radial components are still in use depending on the production item. MEK Group has automatic insertion machines that can handle jumpers, axial and 7.5mm pitch radial components.
In addition, each mounting line is equipped with an adhesive applicator, allowing for the production of SMT and discrete mixed boards.
Meanwhile, for the soldering process, we have eutectic and Pb-free solder baths, enabling us to produce a wide variety of boards.

Board coating is a technology in which a liquid material is applied to electronic components on a printed circuit board and then dried to form a protective film.
It is used in servers, automotive products, aviation products, etc.
Circuit board coating is necessary as a preventative treatment to ensure that circuit boards and electronic components function properly even in harsh environments.
For example, the role of substrate coating is to prevent corrosion, oxidation, short circuits caused by dust, and breaks.
This allows the board to function properly even in dusty and dirty environments.
It also protects the board from humidity.
If moisture adheres to components mounted on a circuit board, it can cause an electrical short circuit due to ion migration, which can lead to product failure.
Therefore, coating is important from the viewpoint of moisture prevention. Coating is also applied to improve heat resistance and impact resistance.

We offer a variety of coating methods, including fully automatic coating equipment with automatic appearance inspection functions, simple robots, and hand painting with paintbrushes, depending on your specifications, whether you want to coat the entire surface of the substrate or just a specific area.

A press-fit connector is a press-fit type electronic component that consists of a housing and connector terminals called press-fit terminals.
Electrical connection is achieved by pressing this press-fit terminal into a through-hole in the printed circuit board.
The terminals of press-fit connectors have a unique feature that sets them apart from conventional insertion parts: they have spring properties.
When this terminal is pressed into the through-hole, the spring's restoring force returns the compressed part to its original position, ensuring an electrical connection inside the through-hole.
The use of press-fit connectors simplifies the manufacturing process, and because they are mounted without solder, the thermal impact of reflow and flow processes on already mounted electronic components is minimized.
In addition, since no solder is used, quality variations can be minimized.
Compared to conventional insertion components, the prohibited placement area near the insertion terminals is narrower than with the flow mounting method.
The area available for placing electronic components is increased, allowing for more dense placement of electronic components.

When rework of mounted components becomes necessary, advanced rework techniques suited to each component are required. Components that have electrodes on the backside and cannot be reworked with a soldering iron require special rework techniques using special heaters or far-infrared heating.

[BGA/CCGA]
BGA and CCGA are special electronic components with solder balls and pillar-shaped terminals arranged in a grid pattern on the underside of the component.
Because there are electrodes on the backside, it is difficult to remove and requires special equipment and conditions.
When reworking a BGA, the solder balls on the component side are damaged, making it impossible to remount, so reballing is also required when remounting.

[LGA/QFN]
LGA and QFN components have connection pads on the underside, so stable solder supply and heating are required during rework.
Ultra-small chip components (0402, 0603)
Extremely detailed work requires high skill.
Ultra-multipole array type connector (Samtec connector)
It requires a stable solder supply and special heating conditions.

We provide stable rework by setting appropriate conditions for each part.

Board cleaning is a process that removes flux residue and other foreign matter that occurs during the production process.
Our cleaning process involves washing, rinsing and drying.

[Circuit board cleaning machine group factory: owned by Kanagawa Marantz Co., Ltd.]
　Vacuum cleaning and drying machine (HEARVY-4252/Crimby)
・A new generation cleaning machine that replaces conventional fluorocarbon and semi-water-based cleaning machines
- Uses glycol ether cleaning liquid, which is essential for flux cleaning
・Supports large substrates (maximum: 500 x 450)

In the AOI business, we offer a wide variety of products based on over 25 years of experience as a specialized manufacturer of circuit board visual inspection equipment.
In product development, we are actively working on developing energy-saving products and products with an eye on Industry 4.0, and continue to take on the challenge of revolutionizing the value of inspection machines.