Bottom 3D Inspection Machine
Specialized in DIP solder
inspection
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Full 3D inspection machine that enables solder volume inspection and pin length measurement inspection.
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Features
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Solder-specific inspection
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Solder volume inspection to detect excessive or insufficient solder
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Pin length inspection to detect solder spikes and floating parts |
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Specification
*Please note that above specification is subject to change without notice. Please be sure to confirm the updated specification at the time of purchase.
| Model Name |
X02WB-350 |
| External Dimension |
W980 x D998 x H1210 (mm) |
| Weight |
210kg |
| Power Supply |
AC100V - 240V |
| Power Consumption |
1,000W (Incl. PC) |
| Operating Environment |
15-30℃ 15-80%RH (No Condensation) |
| Max. Speed |
500 mm/sec |
| Maximum PCB size |
Mini: 50x50 mm Max: 350x250 mm |
| PCB Fixing Method |
PCB outline hold down type |
| PCB Weight |
1.5 kg |
| Clearance |
Top: 150mm, Bottom: 150mm (Area sensor type)
Top: 100mm, Bottom: 150mm (Auto door) |
| Cameras |
9 Mega-pixel top camera |
| Main Lens |
Telecentric Lens |
| Lens resolution |
19 μm |
| Field of View |
60.2 x 60.2 mm |
| Lighting system |
White (3D dedicated lighting) |
| Inspection Algorithm |
Four-way projection |
| Inspection Time |
1.2 sec / shot (Squares 60mm FOV) |
| Height inspection |
±6mm from surface (Max. 12mm on PCB) /
Measurement accuracy ±20μm |
| Inspection Targets |
DIP unsoldered / Excess solder / Less solder / Solder spike /
Bridge / Extra part / Existence / Barcode reading |
Please note that above specification is subject to change without notice.
Please be sure to confirm the updated specification at the time of purchase.
Downloads
Software
For operation software and library tools
download
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Manuals
For product manual data (PDF)
download
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Catalogs
For product catalog data (PDF)
download
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