We will be exhibiting the following equipment at the 40th Internepcon Japan.
Date: Wednesday, January 21, 2026 – Friday, January 23, 1, 10:00 – 17:00
Venue: Tokyo Big Sight East Hall 1F "E7-52"
[Exhibited models]
●Double-sided printing compatible laser marker "LMXR-350L"
Made by mek Separate loader "MED", unloader "MEU",PCB cleaner "PCB-Cleaner"Set display of
●Desktop PCB visual inspection device "U22XJDA-550H"
Laser height detection, 8-angle camera mounted, compatible with tabletop L-shaped boards
●Bottom surface full 3D inspection device “X02WB-550L”
Specializing in DIP solder fillets, inline bottom full 3D inspection equipment compatible with L-shaped boards
●UV coating agent automatic inspection device "D22XUV-350L"
Moisture-proof coating inspection and component inspection are integrated into one machine. In-line double-sided simultaneous inspection device
●Desktop multi-function inspection device "i22X-300"
Space-saving installation, ideal for visual inspection of circuit boards and post-processing
We know you are busy, but please take this opportunity to stop by our booth.
We look forward to your visit.
